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SAMES now has ISO 9001:2000 Certification!
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The SAMES wafer fabrication facility boasts an ultra clean area of 1400 m2, which easily accommodates the requirements of sub-micron processing. Reliable, low-cost 150 mm wafer processing line has been installed and this, together with flexible manufacturing techniques, enables SAMES to offer a responsive service with competitive cycle times.

SAMES’s process technologies are focused on CMOS, covering the requirements for digital and analogue circuits. SAMES employs sophisticated statistical process control (SPC) methods with stringent quality control procedures, ensuring the highest process stability and world class yields.

PROCESS SELECTION GUIDE

Process Name Technology Feature Size Well Type Poly Layers Metal Layers No. Mask Levels Voltage Comments
C200X CMOS 2.0µm P 1/2 1/2 8/9 5 V 2 µm CMOS Digital/Mixed Signal process
C2020 CMOS 2.0 µm Twin 2 2 12 5 V 2 µm CMOS Mixed Signal process.
C2025 CMOS 2.0 µm Twin 2 2 13 5 V 2 µm CMOS Mixed Signal Low Vt process.
C204X CMOS 2.0 µm Twin 1 2 11 5 V 2 µm CMOS
C1201 CMOS 1.2 µm N 1 2 11 5 V 1.2 µm(Single Poly) Digital process
C1202 CMOS 1.2 µm N 2 2 12 5 V 1.2 µm (Double Poly) Mixed Signal process
C1209 CMOS 1.2 µm N 2 2 14 5 V 1.2 µm CMOS Mixed Signal EEPROM process.
C1219 CMOS 1.2 µm N 2 2 15 5 V New 1.2 µm CMOS EEPROM with Hi Res Poly option
C1221 CMOS 1.2 µm N 1 2 12 5V/35 V New1.2 µm CMOS with added 35 V CMOS devices
C1210 CMOS 1.2 µm N 2 2 14 3/5 V 1.2 µm CMOS with added Zero Volt VT transistors.
C1230 CMOS 1.2 µm Twin 2 2 13 5 V 1.2 µm CMOS Mixed Signal with High Res Poly option.
C1233 CMOS 1.2 µm Twin 1 2 11 5 V 1.2 µm CMOS Digital process.
C1234 CMOS 1.2 µm Twin 2 2 12 5 V 1.2 µm CMOS Mixed Signal process.
C1015 CMOS 1.0 µm Twin 2 2 13 5 V 1.0 µm CMOS Mixed Signal process.
C1017 CMOS 1.0 µm Twin 1 2 12 5 V 1.0 µm CMOS Digital process.

CAPABILITIES

SAMES provides a world-class quality and volume manufacturing service and is a respected supplier in the highly competitive global arena. The wafer fabrication Class 1 clean room area incorporates stepper-based lithography with sub-micron capabilities. The waferfab is in great demand by OEMs because of the competitive process technologies available, quick turnaround time, high yields and attractive 150 mm wafer prices. The company currently offers production volumes in 2 µm, 1.2 µm and 1 µm double metal and double polysilicon CMOS technologies, as well as the 1.2 µm E2PROM process.

The capabilities incorporate a proven infrastructure with experienced technical support in the areas of design, fabrication, packaging, testing and qualification of customer solutions. Numerous design entry-level options are available in order to supply a flexible and responsive customised service. SAMES has successfully fulfilled wafer second-source requirements for both other foundries and fabless semiconductor companies in order to provide a strategic supply of products to these customers.

The foundry, an ISO 9001 accredited facility, has the required quality assurance, quality control, reliability and failure analysis programs in place to ensure that the products, be they wafers, die or packaged devices, conform to customer specifications. The SAMES Test Centre covers all aspects of digital, analogue and mixed signal testing at wafer level as well as final testing once the products have been assembled into ceramic or plastic packages. Testing of most package styles can be accommodated at either elevated or low temperatures, depending on customer requirements.

KEY SERVICE FEATURES

  • low NRE costs
  • competitive cycle times and wafer pricing
  • ISO 9001 registered with proven quality systems based on MIL STD 883
  • flexible design entry points
  • cost-effective and timeous solutions
  • flexible and responsive service
  • MPW (multi-project wafer) service available
  • alternative supply channels in place
 
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