Main Menu
| Home |
| Representatives |
| Energy Measurement |
| Telecommunication |
| ID & Security |
| Customer Specific IC's |
| Silicon Foundry |
| Packaging |
| Testing Service |
| Multi Project Wafer |
| Packaging |
|
|
The in-house assembly facility is qualified in a number of package types. It is aimed at ensuring a quick turn-around time on prototypes, engineering samples and small to medium volume production. High volume plastic packaging such as DIP, SOIC and PLCC is subcontracted to offshore assembly houses. Consistent with stringent quality policies, comprehensive qualifications procedures are undertaken, prior to an assembly house being selected for SAMES products. Once a house has been selected SAMES ensures that quality standards are maintained by carrying out quality and reliability checks on an ongoing basis. The following packages and pin configurations are available, but others can be qualified on request:
Note: Package dimension drawings are available on request This e-mail address is being protected from spam bots, you need JavaScript enabled to view it CHIP-ON-BOARD In addition to plastic package assembly, SAMES offers the ability to co-ordinate chip-on-board assembly (COB), designed to meet customer-specific assembly requirements. TAPE & REEL Tape & reel facilities are available through our qualified offshore assembly house. In some cases this may result in drop shipping direct to the customer address from the assembly house. |
|||||||||||||||||||||||||||||||